TG-G3.0-01

Heatsink thermal paste grease, 3 g weight

  • Keep your computer's CPU cool
  • Practical syringe for easy application

TG-G3.0-01
  • TG-G3.0-01
  • TG-G3.0-01
  • TG-G3.0-01

Thermal compund (grease) for heatsinks

Helps the heat dissipation from a CPU, chipset or processor to a heatsink

Excellent thermal impedance

Perfect stability - will not separate, run, migrate, or bleed

Non capacitive or electrically conductive


Additional information
TG-G series datasheet (1679 kb)
MSDS for TG-G grease series (309 kb)
Specifications
Weight: 3.0 g
Color: gray
Thermal conductivity: > 4.5 W / mK
Thermal Impedance <0.205 ° C-in2 / W
Density: > 2.5
Evaporation: <0.001 %
Volatility: <0.005 %
The dielectric constant: > 5.1
Dissipation Factor: <0.005
Viscosity: 76 CPS
Thixotropic index: 310 ± 10 ° C
Operating Temperature: -50 ~ 240 ° C
Composites: 50% silicone compounds
Compounds: 30% of carbon
The compounds of metal oxides: 20%
Packing details
Q'ty in crtn, pcs100
Crtn volume, CUM0.041496
Crtn weight, kgs3.6
Individual package size LxWxH:180x120x15 mm
Carton size LxWxH:390x380x280 mm
Country of originCN
Barcode8716309083133
Customs code3402909000
Packagingblister
Trade Mark
Package preview
(137 kb)
Hi-Res photos
package (2187 kb)
(661 kb)
(719 kb)
Product information sheet



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